I-Qualcomm imemezele imikhiqizo emibili emisha ebalulekile ku- Embedded World 2024. Omunye wayo ipulatifomu ye-Qualcomm RB3 Gen 2, isisombululo sehadiwe nesofthiwe esenzelwe amarobhothi, i-Internet of Things (IoT), kanye nezinhlelo zokusebenza ezifakiwe. Le pulatifomu isekelwe kuphrosesa ye-Qualcomm QCS6490.
Ipulatifomu ye-RB3 Gen 2 inikeza ukusebenza okuphezulu ngenxa yeprosesa yayo ye-octa-core kanye namakhono e-AI angu-12 TOPS. Iphinde ibe ne-RAM engu-6GB kanye nesitoreji esingu-128GB ukuqinisekisa ukusebenza kahle kohlelo lokusebenza.
Lesi yisinyathelo esikhulu esiya phambili ekuthuthukisweni kwamadivayisi ahlakaniphile namarobhothi anamandla futhi asebenzayo. Ngenxa ye-QCS6490 SoC ye-Qualcomm, inikeza intuthuko enkulu ekusebenzeni nasekuhlakanipheni kokwenziwa kwamadivayisi afakiwe . Ngenkathi i-QCS6490 ingakaze ikhulunywe ngayo ngaphambili, besijwayelene ne-QCM6490, imodemu ye-5G yama-smartphone. Ngokungafani ne-QCM6490 egxile ku-Android, ipulatifomu ye-RB3 Gen 2 i-QCS6490 isebenzisa i-Qualcomm Linux ene-kernel ye-LTS kanye nesofthiwe ye-IoT.
Futhi le RB3 Gen 2 ingasetshenziswa ukunika amandla amarobhothi, ama-drone, amadivayisi ezimboni aphathekayo noma afakiwe, kanye ne-IoT, okuletha ukuthuthukiswa kwe-AI kule mikhakha. Ungayi-oda kusengaphambili manje kusukela ku-$399 . Ngale ntengo, uzothola:
- Umthamo omkhulu wokucubungula- Iletha ukucutshungulwa kwe-AI okungu-10x okuthe xaxa kudivayisi kunenkundla yangaphambilini ye-RB3.
- Ukusekelwa kwamakhamera amaningi nombono womshini: ikuvumela ukuthi usebenzise izinzwa zekhamera eyi-8MP+ futhi ucubungule izithombe ngokubona kwekhompyutha.
- ukuxhumana okuthuthukile- Ihlanganisa i-Wi-Fi 6E ukuze uthole uxhumano olungenantambo olunesivinini esikhulu.
- Ukuhambisana okubanzi- Isebenza ku-Qualcomm Linux kanye nokwesekwa kwe-Android kulindeleke esikhathini esizayo. Ngaphezu kwalokho, inikeza ama-SDK ambalwa ukuze athuthukiswe.
- Impilo ende ewusizo: I-Qualcomm iqinisekisa iminyaka engu-15 yokusekelwa kwephrosesa ye-QCS6490, cishe njengama-chips ebanga lezimoto…
Izici zobuchwepheshe ze-Qualcomm RB3 Gen 2
Ngokuphathelene nezincazelo zobuchwepheshe zale motherboard ye-Qualcomm RB3 Gen 2, kumele sigqamise okulandelayo:
- I-SoC:
- I-Qualcomm QCS6490 enama-cores angu-8 e-ARM ane-Kryo microarchitecture, i-Adreno GPU ne-Hexagon DSP AI accelerator.
- Inkumbulo eyinhloko:
- 6 GB we-LPDDR4x RAM (iphakheji ye-umCP)
- Isitoreji:
- I-128GB UFS Flash (iphakheji ye-uMCP)
- I-slot yekhadi le-MicroSD
- I-PCIe slot yokwandisa ye-NVMe SSD
- Khombisa
- Isixhumi se-HDMI
- I-USB Type-C enokwesekwa kwe-DP
- i-DP encane
- Ukwandiswa kwe-DSI
- Kufika kuzikrini ezingu-2x ngesikhathi esisodwa
- Ikhamera:
- Ikhithi eyinhloko: 2x C-PHY/D-PHY 30-pin ukuze kunwetshwe ebhodini
- Ikhithi Yombono: 1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP enebhuleki, kanye nembobo eyengeziwe ye-D-PHY ne-GMSL
- Audio
- Ikhithi engu-Core: 1x DMIC, 2x amplifiers digital, I2S/Soundwire/DMIC isixhumi esinesivinini esiphansi
- I-Vision Kit: 4x DMIC, 2x amplifiers digital, I2S/Soundwire/DMIC isixhumi esinesivinini esiphansi
- Amanethiwekhi
- Uhlobo olungenantambo i-802.11ax WiFi 6E ene-DBS efika ku-3.6 Gbps
- I-Bluetooth 5.2 esekelwa umsindo we-LE
- Ama-antenna angu-2x aphrintwe ku-PCB, isixhumi sokunweba se-RF sokuzikhethela izimpondo zangaphandle
- Izimbobo ze-USB:
- 1x USB 3.0 Uhlobo-C
- 1x USB 2.0 w/OTG
- 2x USB 3.0 Uhlobo-A
- 1x USB 3.0 Hi-Speed
- I-PCIe interface:
- 1x PCIe Gen 3 2-umzila wokwandisa
- 1x PCIe Gen 3 1-umzila wokwandisa ngokuzithandela
- Izinzwa:
- I-Core Kit: I-IMU ehlanganisiwe (ICM-42688), ukunwetshwa okwengeziwe
- Ikhithi Yombono: I-IMU (ICM-42688), inzwa yokucindezela (ICP-10111), inzwa kazibuthe/ikhampasi (AK09915), ukunwetshwa okwengeziwe
- Ukunwetshwa:
- Izixhumi eziphansi nezinejubane eliphezulu ze-Mezzanines (96boards)